共找到 150 條與 返修 相關(guān)的標(biāo)準(zhǔn)，共 10 頁
Printed board rework and rework
本標(biāo)準(zhǔn)規(guī)定了印制板返修、修理和修改的內(nèi)容和方法(與印制板制造方法無關(guān))。 本標(biāo)準(zhǔn)適用于印制板、印制板組裝件的某些缺陷的修復(fù)。 本標(biāo)準(zhǔn)是否被采用必須由供需雙方協(xié)商確定
Re-work,repair and revision of printed boards
GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
LASER Lap Welding Acceptance and Repair Procedure Issue 4
Requirements for the Use of Rework Materials in Manufacturing of Polyethylene Gas Pipe
本文件規(guī)定了適用于電子組裝件焊接的返工、改裝和返修的內(nèi)容和工藝要求。 本文件適用于將元器件與印制板和最終產(chǎn)品相關(guān)部件連接的電子組裝件焊接制造過程中的返工、改裝和返修，也適用于混合安裝技術(shù)產(chǎn)品組裝中的相關(guān)作業(yè)活動(dòng)。 本文件也包括與返工相關(guān)的設(shè)計(jì)內(nèi)容的指南
Rework, modification and rework process requirements for electronic assembly welding
Fixture reticle rework fixture for cold working of optical parts and special process
Indica le prescrizioni costruttive, la designazione e la marcatura richieste per le bobine di legno a rendere usate per l' avvolgimento di corde
Returnable wooden drums for stranded and bare conductors. Manufacturing specifications, designation and marking.
Factory Information Systems (FIS) form the nervous system of an enterprise, analyzing data and delivering information to the machines and people who
Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework
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Workmanship requirements for soldered electronic assemblies－Part 5：Rework, modification and repair of soldered electronic assemblies
This standard establishes a test method for determining if connectors or sockets can withstand exposure to solder rework conditions using either
TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards
TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards
Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems
Process management for avionics - Aerospace and defence electronic systems containing lead free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IEC/TS 62647-23: Process management for avionics - Aerospace and defence electronic systems containing lead free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
